Summary
The PCB used for placing the BGA components is known as BGA PCB. It contains similar connections, just like the ball grid array present on the back of the BGA package. The component is placed over the PCB and then soldered. After soldering, the package looks as if it is pasted on the board with glue. There are no leads or connections on the side of the BGA package, and it makes the PCB more reliable and offers many benefits.
This report contains market size and forecasts of Ball Grid Array (BGA) PCB in global, including the following market information:
Global Ball Grid Array (BGA) PCB Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Ball Grid Array (BGA) PCB Market Sales, 2017-2022, 2023-2028, (K Sqm)
Global top five Ball Grid Array (BGA) PCB companies in 2021 (%)
The global Ball Grid Array (BGA) PCB market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period 2022-2028.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Plastic Ball Grid Array Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Ball Grid Array (BGA) PCB include Samsung Electro-Mechanics, Nanya PCB, TTM Technologies Inc., Unimicron, Shennan Circuits, CMK Corporation, Kingboard, Creative Hi-tech Ltd. and Mer-Mar Electronics, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Ball Grid Array (BGA) PCB manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Ball Grid Array (BGA) PCB Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Sqm)
Global Ball Grid Array (BGA) PCB Market Segment Percentages, by Type, 2021 (%)
Plastic Ball Grid Array
Ceramic Ball Grid Array
Tape Ball Grid Array
Enhanced Ball Grid Array
Flip Chip Ball Grid Array
Micro BGA
Global Ball Grid Array (BGA) PCB Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Sqm)
Global Ball Grid Array (BGA) PCB Market Segment Percentages, by Application, 2021 (%)
Consumer Electronics
Communications Industrial
Industrial
Others
Global Ball Grid Array (BGA) PCB Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Sqm)
Global Ball Grid Array (BGA) PCB Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Ball Grid Array (BGA) PCB revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Ball Grid Array (BGA) PCB revenues share in global market, 2021 (%)
Key companies Ball Grid Array (BGA) PCB sales in global market, 2017-2022 (Estimated), (K Sqm)
Key companies Ball Grid Array (BGA) PCB sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Samsung Electro-Mechanics
Nanya PCB
TTM Technologies Inc.
Unimicron
Shennan Circuits
CMK Corporation
Kingboard
Creative Hi-tech Ltd.
Mer-Mar Electronics
JHYPCB
Multi Circuit Boards Ltd.
PCBAStore
Sierra Circuits
Cirexx
Pcbcart
RayMing
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